Engineering Services & Development Capabilities
At Cornet Technology India, we don’t just manufacture rugged boards—we engineer solutions. From concept design to long-term support, we provide end-to-end services tailored to the defense, aerospace, and mission-critical sectors. Whether it’s customizing a COTS board, integrating firmware into your system, or building a full ATR system for your platform—we’ve got it covered.
Our Process
All the skills to design and support High-Performance Embedded Computers (HPEC)
Interface Concept develops in-house unique and original products that are relevant to system integrators looking for high performance and reliable global solutions. This product offering is backed by an effective and relevant technical support, enabling integrators to focus on their core business while reducing their time-to-market.
Interface Concept is deeply involved in all the system development stages, from specification analysis to product life cycle management. Each step of the board design process, from hardware, software, and BIOS, is performed and managed in house by a highly qualified engineering team, with a long established expertise in embedded technologies, to deliver the best solutions to customers.
- Specification Analysis
Strive to understand our customers’ needs, requirements and challenges by working closely with them. - Architecture Proposal
Propose an optimized and competitive solution based on an existing product (COTS), a customized existing product (MCOTS) or a fully customized product. - Hardware and Software Design
Ensure design quality, leveraging the industry’s best practices and Interface Concept’s highly skilled Engineering team. - Communication and Processing Building Blocks
Offer a comprehensive product range that includes all the basic bricks of an embedded system: SBC/DSP, FEP, Switch, I/O boards, with firmware and IP cores.

- Prototype Integration and Qualification
Help our customer reduce time-to-market by offering product prototypes for integration and qualification. - Support
Leveraging Interface Concept’s highly skilled engineering team, provide technical support to our customers throughout system development and deployment. - Life Cycle
Secure our product long-term availability with a strong supervision of our suppliers and the semi-conductor market.



Resources to manufacture quality state-of-the-art COTS and custom products
Components and PCB are provisioned from approved manufacturers according to bill of materials.
Boards are assembled and manufactured according to a qualified and well-established process, compliant with IPC-A-610 Class 3 Standard.
Boards are controlled further to each manufacturing process step.
Each board is functionally tested according to a qualified and proven test process.
Further to the coating process and mechanical part set-up, each board undergoes environmental screening test complying with the board grade specification (on request).
Certification

IP FPGA Cores
Together with its COTS Single Board Computers and FPGA boards, Interface Concept supplies a comprehensive range of FPGA IP cores intending to provide innovative technical responses to applications requiring specific functions:
- PCI Express to VME bridge
- IP DMA
- SFPDP – Serial Front Panel Data Port
- HDLC – High-Level Data Link Control
- ARINC 818
- L2 Gigabit Ethernet switch

Our Resources
- PCB CAD Suite from Mentor
- Keysight ADS
- High-Performance Oscilloscopes
- Digital and analog signal analysers
- Spirent Test Center
- 45 GHz vector network analyzer (VNA)
- High-performance signal generators
- High-speed digital/analog design: Keysight ADS SI/PI Pro – Momentum
- Coupled Thermal and CFD computation software : 6SigmaET from Future Facilities


Our Grades
(*) Temperature grades are subject to availability according to IC products. Please consult us.
Standard | Extended | Rugged | Conduction-cooled 71°C | Conduction-cooled 85°C | |
Coating | Optional | Yes | Yes | Yes | Yes |
Operat. Temp. | 0 to 55°C | -20 to 65°C | -40°C to 71°C (*) | -40°C to 71°C at the thermal interface (*) | -40°C to 85°C at the thermal interface (*) |
Rec. airflow | 1 .. 2 m/s | 2 .. 3 m/s | 2 .. 5 m/s | – | – |
Oper. HR% no cond. | 5 to 90% | 5 to 95% | 5 to 95% | 5 to 95% | 5 to 95% |
Storage Temp. | -45°C to 85°C | -45°C to 85°C | -45°C to 100°C | -45°C to 100°C | -45°C to 100°C |
Sinusoidal Vibr | 2G [20..2000]Hz | 2G [20..2000]Hz | 5G [20..2000]Hz | 5G [20..2000]Hz | 5G [20..2000]Hz |
Random Vibr | 0.002g2 /Hz [10..2000]Hz | 0.002g2 /Hz [10..2000]Hz | 0.05g2 /Hz [10..2000]Hz | 0.1g2 /Hz [10..2000]Hz | 0.1g2 /Hz [10..2000]Hz |
Shock 1/2 Sin. 11ms | 20G | 20G | 40G | 40G | 40G |